Terms & Phrases for XPS

  • 4p Electron defect
  • Absolute charge referencing
  • Acceptance angle
  • Accuracy
  • Additivity rules
  • Adsorbed water
  • Adventitious carbon
  • Air-borne molecular carbon (AMC)
  • Algorithms
  • Analyzer
  • Analyzer work function
  • Angle dependent etching
  • Angle lapping
  • Angle of incidence
  • Anodes
  • Applications
  • AR-XPS
  • Asymmetry parameter
  • Atom % calculations
  • Atom % check
  • Atomic relaxation
  • Auger parameter
  • Auger parameter plot
  • Auger peaks
  • Background
  • Background removal
  • Background shape
  • Backscattering
  • Ball cratering
  • Band gap
  • Basic physics of XPS
  • Basics
  • BE calibration
  • BE histograms
  • BE overlaps
  • BE tables
  • Beam shape vs X-ray FWHM
  • Beer-Lambert’s law
  • Bond ionicity
  • Born-Haber cycle
  • Bremsstrahlung
  • Bulk analysis methods
  • Calculated BEs
  • Calibration
  • Calibration BEs
  • Calibration run chart
  • Carbon coating
  • Carlson RSF correction
  • CAT, CAE, CPE
  • CHA (HSA)
  • Channeltron
  • Charge compensation
  • Charge control
  • Charge control tests
  • Charge dependent studies
  • Charge referencing
  • Charge transfer bands
  • Chemi & Physi-sorption
  • Chemical shifts
  • Chemcial species
  • Chemical states
  • Chemicals
  • CMA
  • Common contaminants
  • Complete unknown
  • Component description
  • Components
  • Compton effect
  • Conferences
  • Configuration interaction
  • Conformational changes
  • Contaminants
  • Convolution
  • Cooper minimum
  • Crater edge effect
  • CRR, FRR
  • Data exchange
  • Data export
  • Data features
  • Data interpretation
  • Data processing
  • Data quality
  • Data reliability
  • Data tables
  • Databases
  • Deadtime correction
  • Deconvolution
  • Delay Line Detector (DLD)
  • Demo guide
  • Demonstrations
  • Depth profiling
  • Detection limits
  • Detector noise
  • Detector saturation
  • Detectors
  • DFT calculations
  • Discriminator
  • Doniach-Sunjic baseline
  • Dopant effects
  • Double ionization
  • Downtime
  • DP-CMA
  • Elastic energy loss
  • Electron density
  • Electron detector
  • Electron escape depth
  • Electron polarization
  • Electron retardation
  • Electron take off angle
  • Electronegativity
  • Electrons
  • Energy analyzer
  • Energy distribution curve (EDC)
  • Energy resolution
  • Etch rate calibration
  • Etch rates
  • Exchange splitting
  • Exhibitions
  • Expert system
  • Experts
  • Faraday cup
  • FAT, FAE, FPE
  • Fermi edge
  • Fermi level
  • Filaments
  • Final state effects
  • Flood gun
  • Flux dependent studies
  • Forward scattering
  • Franck-Condon principle
  • Gaussian shape
  • Gaussian shape due to electron analyzer
  • Ghost
  • Gold coating
  • Gold deposition method
  • Grazing X-rays effect
  • Guidelines
  • Hardware ease of use
  • High resolutions scan
  • History of XPS
  • Hole lifetime vs FWHM
  • HSA (CHA)
  • HWHM quantification method
  • Hydrocarbon
  • Hydrocarbon deposition
  • IMFP
  • Inelastic energy loss
  • Information (data)
  • Information depth
  • Initial state effects
  • Instrument component
  • Instrument description
  • Instrument geometries
  • Instrument maintenance
  • Instrument makers
  • Instrument prices
  • Instrument reliability
  • Instrument repair
  • Instrument response
  • Instrument sales
  • Instrument validation
  • Interface widths
  • Internal energy referencing
  • International BEs
  • International registry
  • Inverse photoelectron emission
  • Ion cleaning
  • Ion etching
  • Ion gun
  • IPS
  • Islanding
  • ISO
  • Jahn-Teller effect
  • Journal editors
  • Journals
  • Kikuchi effect
  • Knock-in effect
  • Koopmans’ theorem
  • Koster-Kronig effect
  • Laser cleaning
  • Laser-XPS
  • Leak checking
  • Least squares curve fitting
  • Lifetime broadening
  • Lifetime of clean surface
  • Lifetime of parts
  • Limits of XPS
  • List of tables
  • Lorentzian shape
  • Lorentzian X-ray FWHM
  • Madelung potential
  • Magic angle
  • Marquardt-Levenberg fittting
  • Matrix effects
  • Maximum entropy
  • MCP
  • Metal clusters
  • Metal oxide exchange
  • Monochromatic X-rays
  • Monochromator
  • Mossbauer-XPS
  • Multiplet splitting
  • Multiplexing
  • Multivariate analysis
  • Native oxides
  • Nearest neighbor effects
  • Needs
  • NIST database
  • NMR-XPS correlation
  • Non-mono X-rays
  • Ohmic contact
  • Oil/liquid studies
  • One electron approximation
  • Parallel imaging
  • Peak assignment
  • Peak broadening
  • Peak fitting constraints
  • Peak fitting logic
  • Peak identification
  • Peak overlaps
  • Peakshape
  • Pellet press
  • Penetration depth
  • Performance tests
  • Permissible error
  • Phonons
  • Photoionization
  • Physics of XPS
  • Plasmons, surface & bulk
  • Polarized X-rays
  • Powder pellet press
  • PPM level detection
  • Precision
  • Principal component analysis
  • Problem solving
  • Problems & causes
  • Problems & solutions
  • PSD
  • Pulse-counting
  • Quantification
  • Random noise
  • Re-deposition
  • Reduced chi square
  • Reference BEs
  • Reference FWHMs
  • Reference materials
  • Reference spectra
  • Reference standards
  • Registry
  • Relative error
  • Relative Sensitivity Factor (RSF)
  • Relative sputter yield
  • Relativistic correction
  • Reliability
  • Repair
  • Repeatability
  • Reproducibility
  • Research topics
  • Retardation
  • Reverse engineering
  • Rotational depth profile
  • Rotational etching
  • Round robin studies
  • RSF calculation
  • RSFs
  • S/B
  • S/N
  • Sample cleaning
  • Sample damage
  • Sample degradation
  • Sample fracturing
  • Sample handling
  • Sample mounting
  • Sample mounts
  • Sample prep
  • Sample scraping
  • Sample stage
  • Scatter diagram
  • Scattering
  • Science of XPS
  • Search
  • Sensitivity factors
  • Service contracts
  • Service quality
  • Shake-up, shake-off
  • Siegbahn, Kai
  • Signal to background, S/B
  • Signal to noise, S/N
  • Silver paint
  • Smoothing
  • Snap-shot spectra
  • Software
  • Software ease of use
  • Software features
  • Solutions
  • Space charge
  • Spatial resolution
  • Spectra databases
  • Spectrometer work function
  • Spectrum features
  • Spectrum subtraction
  • Spin polarized electrons
  • Spin-orbit coupling
  • Sputter gun
  • Standards
  • Statistical analysis
  • Sticking coefficients
  • Strengths of XPS
  • Submit data
  • Submit photos
  • Submit spectra
  • Subtraction
  • Supplies
  • Surface chemistry
  • Surface core level shift (SCLS)
  • Surface derivatization
  • Surface dipole moment
  • Surface migration
  • Surface morphology
  • Surface physics
  • Surface reconstruction
  • Survey scans
  • Synchrotrons
  • System bake-out
  • Systematic noise
  • Target factor analysis
  • Technique comparisons
  • Temperature studies
  • Theory of XPS
  • Thickness calculations
  • Thickness measurements
  • Thickogram
  • Time dependent studies
  • Titanium getter
  • Tool owner feedback
  • Tools
  • Tougaard baseline
  • TPP-2M equation
  • Trace analysis
  • Traceability
  • Training
  • Training courses
  • Training movies
  • Transfer rod
  • Transmission function
  • Troubleshooting
  • Uncertainty
  • University labs
  • Unknown material
  • Unscanned spectra
  • User manuals
  • Users
  • Vacuum exposure studies
  • Vacuum level
  • Vacuum pumps
  • Valence band spectra
  • Validation
  • VAMAS
  • Vibrational broadening
  • Voigt baseline
  • Water
  • Weaknesses of XPS
  • Work function
  • XPS peaks
  • X-ray hazard
  • X-ray satellites
  • X-ray physics
  • ZnS phosphor