| Adsorbed gases (CO2, O2, H2O) |
| XPS after SEM |
| After baking |
| Anode induced ghost |
| Anode lifetime |
| Baking effects |
| Conductive tape |
| Conductive tape – not so conductive – insulating |
| Contamination spread |
| Data analysis |
| Data artefacts (ghost, spike, …) |
| Data processing |
| Depth profiling |
| Double side tape |
| Dropped sample |
| Electron gun lifetime |
| Filaments |
| Hardware problems |
| Hardware troubleshooting |
| Instrument baking |
| Instrument calibration |
| Ion beam degradation |
| Ion beam induced mixing |
| Leak checking |
| Leaks |
|
| Magnetic lens – effect on AR-XPS |
| Multi-technique surface analysis |
| Need beam alignment |
| Need column alignment |
| Need crystal alignment |
| Oxide buildup on lens – Au coat to solve |
| Peak overlaps – Al over Cu, Sb over O etc. |
| Peak overlaps – auger on XPS |
| Peak overlaps – non-mono satellites |
| Polymer to graphite after Ar+ etch |
| Potential breakage of mono crystals |
| Preferential sputtering |
| Scotch brand Invisible tape |
| SEM last – carbon buildup |
| Software troubleshooting |
| Surface migration |
| Tapes in vacuum |
| ToF-SIMS – after XPS |
| Virtual vacuum leaks |