Cheat-Sheet Check List (Do List)



Producing & Publishing XPS Data from Simple Materials

This list assumes that you are allowed to operate the XPS instrument, the Argon Ion (Ar+) etching gun, and know how to exchange sample mounts safely.

X-ray Type:  Monochromatic Aluminum X-rays 


  1. Check “Instrument Status” before trying to use the XPS instrument
    • Is a sample still inside the analysis chamber?
      • If true, then remove sample
      • If there are no samples inside, then continue
    • Is the sample-viewing camera or microscope working?
      • If true, then continue
    • Is vacuum in analysis chamber <1 x 10 (-7) mTorr?
      • If true, then you are ready to check instrument Calibration BEs, flood gun alignment, and X-ray beam position
      • Cut each Calibration Metal to ~5 x 10 mm size. Trap metals using screws or clips.  Do NOT use double-sided conductive tape.
      • Using a clean single edged razor blade, scrape a 4×4 mm area on the Copper (Cu) sample used to check the Calibration BEs
      • Cut a piece of polypropylene to be ~5 x 5 mm size.  Scrape the surface with a clean single edged razor blade or a knife. Use double sided tape (3×3 mm) to hold polypropylene.
      • Load sample mount that has all 3 Calibration Metals (Cu, Ag, Au), polypropylene (or Teflon), and X-ray Phosphor (P-31, ZnS) into Prep-Lock (Load-lock)
      • Wait until pressure is <1 x 10 (-7) mTorr
      • Pressure should be <5 x 10 (-8) if you want to collect data to be published
      • If pressure is >1 x 10 (-6) mTorr, absolutely do NOT turn on any filaments.  Immediately Contact Service.
      • NOTE:  If vacuum pressure is >1 x 10 (-6) mTorr, then all collected data will be bad and filaments oxidized or broken.
    • Is cooling water used to cool Aluminum X-ray source running?
      • Is water flow rate high enough?  (>3 L/min).  If true, then continue
      • Is water line cool, not cold, to touch?  (If too cold, then condensation can cause corrosion.)
  2. Record “Calibration BEs” and check X-ray Beam position using ZnS phosphor
    • If X-rays are ON, then turn X-rays OFF
    • If Flood Gun (FG) is ON, then turn FG OFF
    • Transfer “Calibration Metals” (Cu, Ag, Au), polymer (polypropylene or Teflon) and X-ray Phosphor (P-31) from Load-Lock into “Analysis Chamber”
    • Was Copper (Cu) Calibration Metal sample scraped?  If not, then you will need longer ion etching to remove oxide.
    • Move “X-ray Phosphor” (ZnS, type P-31) to standard “Sample Analysis Position”
    • When pressure is <1 x 10 (-7) mTorr, continue
    • Turn ON X-rays
      • Maximum power settings
      • Largest spot size
    • Turn ON Argon Ion (Ar+) Gun to standby condition
      • Make sure that ion gun has Argon gas – Do not flood the ion gun with too much Argon (if too much Argon, then filament may break)
      • Select maximum acceleration voltage conditions (2-5 keV)
      • Select maximum current
      • Select 4 x 2 mm (or 4 x 4 mm) raster area
      • (We assume that Argon ion gun is already optimized for routine use.)
    • Adjust stage height to bring ZnS phosphor into good optical focus (Can you see grains?)
    • NOTE:  Good Optical Focus can be different from Good Electronic Focus by as much as 200 microns up or down
      • When sample is not at good electronic focus, then count-rate drops by 10-15% of maximum countrate
      • When sample is not at good electronic focus, then the BEs can shift by 0.1-0.2 eV from true value
    • Verify that X-ray Beam center is nearly same as Green X-ray Spot on ZnS phosphor  (Never ion etch ZnS)
    • If not, then adjust optical microscope (or camera) to match
    • Record Z-Height, and save as “Home Position” (record XYZ position)
    • Move Copper (Cu) to “Home Position”
      • Set analysis conditions to measure Cu (2p3) BE at 932.6 eV (KE = 554 eV) using a 10 eV narrow scan mode, or a SnapShot mode (~20 eV window)
      • Using fast scan conditions with a large Pass Energy, adjust Z-Height until you find Z-Height position that gives maximum count-rate for Cu (2p3) signal
      • Record XYZ position
      • Change argon ion gun from standby to operate (unblank) for a minimum of 60 seconds to remove carbon or oxygen from the freshly scraped Copper surface
      • Using fast scan conditions, adjust Z-Height to find Z-Height position that gives maximum count-rate for Cu (2p3) signal
      • If best count-rate position has changed, then record new XYZ position, and teach new position as new HOME position
      • Change fast scan conditions to measure Oxygen (1s) signal at 530 eV
      • Measure Oxygen (1s) signal for 1-2 scans or use SnapShot mode (10 sec or continuous).
        • If the Oxygen (1s) signal is very noisy, then the Copper surface is clean
        • If the Oxygen (1s) signal is large, then ion etch Copper again, for 2-3 minutes
        • NOTE:  If ion gun is not properly aligned to overlap X-ray Spot, then argon ion etch rate is very small.  Stop and adjust ion gun.
      • Now we are ready to record the Calibration BE of Cu (2p3), Cu (3p) and Valence Band region
        • Select Pass Energy that you normally use to measure high energy resolution (chemical state) spectra
        • Use a 10 eV window to record Cu (2p3)  (2 scans)  [928 – 938 eV]
        • Use a 30 eV window to record Cu (3p)   (2-3 scans)  [60-90 eV]
        • Use a 30 eV window to record Cu Valence Band and Fermi Edge (3-4 scans)  [ -10 to + 20 eV]
      • To check for cleanliness, and to check the “Transmission Function” of the instrument, collect two survey spectra from the copper sample
        • Energy range:  -10 to 1100 eV
        • Pass Energies:  Largest pass energy and pass energy used to measure high energy resolution (chemical state) spectra
        • Number of Scans: one (1) scan
        • Step Size:  0.7-1.0 eV/step
    • Move Gold (Au) to “Home Position”
      • Set analysis conditions to measure Au (4f) BE at 85 eV (KE = 1401 eV) using a 10 eV narrow scan mode, or a SnapShot mode (~20 eV window)
      • Using fast scan conditions with a large Pass Energy, adjust Z-Height until you find Z-Height position that gives maximum count-rate for Au (4f) signal
      • Record XYZ position
      • Change argon ion gun from standby to operate (unblank) for a minimum of 60 seconds to remove carbon from the Gold (Au) surface
      • Now record the Calibration BE of Au (4f) signal
        • Select Pass Energy that you normally use to measure high energy resolution (chemical state) spectra
        • Use a 10 eV window to record Au (4f)  (2 scans)  [79-89 eV]
    • Thank You.  You have completed the essential recording of Calibration BEs from freshly cleaned Calibration Metals (Cu and Au)
      • If you prefer to include Ag (3d) signal, then repeat the Gold cleaning and analysis procedure using Ag (3d) BE at 368.2 eV
  3. For Insulating Sample – check if Electron Flood Gun is properly aligned
    • Turn ON the electron Flood Gun (charge neutralizer)
      • Set FG voltage = ~4 eV (10 mA) for older instruments, or
      • For very modern instruments, set FG voltage = 0.1 eV
    • Move the polypropylene or Teflon sample to “Home Position”
      • Move sample 2-3 mm in X and Y to spray electrons over the entire surface which produces a uniform electrical charge over the sample
      • Move to the center of the polypropylene (or Teflon) sample
      • Set analysis conditions to measure C (1s) BE at 284 eV for polypropylene (or 292 eV for Teflon) using a 20 eV narrow scan mode, or a SnapShot mode (~20 eV window)
      • Using fast scan conditions with a large Pass Energy, adjust Z-Height until you find Z-Height position that gives maximum count-rate for C (1s) signal
      • Record XYZ position
    • If the electron Flood Gun is properly aligned, then the C (1s) signal will be symmetrical and have a FWHM <1.4 eV after peak-fitting
    • If you see a small shoulder or a slope on the low BE side, then the Flood Gun needs to be aligned (the shoulder is due to differential charging)
    • If you look at this webpage (https://xpslibrary.com/charge-compensation) then you will see examples of differential charging and FWHM for polypropylene and Teflon
    • Place a transparent ruler or straight edge on your computer screen.  Line the edge to the center of the C (1s) peak maximum
    • Adjust the X and Y voltage settings (or the physical position) of the flood gun
    • The C (1s) peak will shift to the right to lower BE if you are improving charge control
    • The C (1s) peak will shift to the left to higher BE if you are making the charge control worse
    • Adjust X and Y several times until the C (1s) BE for polypropylene is below 285.0 eV.  For Teflon, the C (1s) BE is ~292 eV.
    • If the X and Y voltage positions are optimized, then the FWHM will be <1.3 eV.
    • If the C (1s) BE and FWHM are not improving enough, then increase the current and the voltage of the electron flood gun by 10%
    • NOTE:  electrons from the flood gun can and do cause degradation of a few materials.  Avoid very high voltage and high current settings
    • NOTE:  if you place a 90% transparent metal mesh-screen ~1 mm above the surface of the sample, then the electric field will decrease and you will get better results (https://xpslibrary.com/charge-compensation)
    • Now, you are ready to collect useful and reliable BEs from both conductors and non-conductors (insulators)
    • Remove the Calibration Metals samples and load your samples.
    • If you have a large sample mount (e.g. >50 x 50 mm, then you should load your samples, the Calibration Metals, the polypropylene, and X-ray phosphor, all together to save time)
  4. Prepare Sample
    • NOTES:
      • Do NOT wear latex gloves (cheap latex gloves have Silicone Oil on outside that contaminate your UHV chamber)
      • Do NOT rinse or wipe surface with acetone or IPA, unless you know that someone has touched the surface to be analyzed.
      • We use Scotch-brand double-sided adhesive tape – very small pieces
      • Smaller sample size minimizes waiting time for sample to finish outgassing, especially porous materials (paper, powder, soft plastic…)
      • Smaller sample size gives better charge control – near edge usually
      • Decide if sample will degrade by exposure to monochromatic X-rays
      • If you suspect that the sample will definitely degrade, then after collecting each spectrum, move sample by 2 mm before collecting next spectrum, and also collect fast 1 scan survey spectrum at start, and also at finish – compare – look for changes in peak heights
    • Solid sample – non-conductive  (ceramic, plastic, glass, non-porous, insulator)
      • Avoid screws, masks, and clips to hold samples – they can cause differential charging near the metal piece
      • Place a 10 x 10 mm piece of Scotch brand non-conductive double sided tape on sample stage/mount (must be slightly bigger than sample size)
      • Use fine sandpaper to clean both edges of a single-edged razor blade or knife, then wipe edge with IPA or acetone
      • Cut or break sample until it is slightly smaller than ~9 x 9 mm (or ~9 x 20 mm).  (This style stops outgas from still exposed tape.)
      • Scribe a line down the middle of the sample, or use Sharpie marker to make a line (Sharpie pens have silicone, but very little)
      • On one side of the scribe line, scrape a 3×3 mm region of surface at 90 deg angle with the freshly cleaned razor blade or knife
      • Use 2 pairs of tweezers – press corners of sample onto double-sided tape
      • Or, place clean Aluminum foil (kitchen) on top of sample, press to make flat, and discard Al foil
      • (Fresh exposed bulk of sample can also give useful results)
    • Small grain or powder sample  (normal laboratory air)
      • NOTES: 
        • Old powders collect moisture from air or CO2 and may change surface chemistry over time.  Drying in a vacuum oven may help.
        • Brand new bottles of powders from chemical maker may be dirty with adventitious carbon, stabilizers, or contaminants
        • Brand new bottles of powders from cheap manufacturing companies will very likely be dirty, have water of hydration – not reported, and have contaminants
      • Clean mortar, pestle, and spatula with acetone and IPA 5 minutes before using. Blow dry with clean air or nitrogen.  Do not use canned gases.
      • Using a clean mortar and pestle, grind grains or powder gently for ~5 minutes
      • Use freshly cleaned spatula to transfer and press powder onto non-conductive double sided tape (tape size: 5 x 5 mm)
      • Use swab or Q-tip to gently brush off excess powder – trap excess powder in empty glove.  Tie glove closed. Dispose safely.
    • Solid sample – conductive  (pure element, film, steel, alloy, wire, fiber, ball-bearing)
      • Use electrical ohm-meter to measure conductivity at surface.  Metals often have thick insulating oxides or machine oils due to production
      • Clean edges of metal cutting shears with acetone and sandpaper before cutting sample
      • Cut sample to be 10 x 10 mm or 20 mm x 20 mm.
      • Scrape a small region where you put the screw or clip that traps sample
      • Scribe a line down the middle of the sample (or use Sharpie pen)
      • Scrape a 4 x 4 mm region with a clean single edged razor blade or knife
    • Solid wafer – semiconductor
      • Cleave wafer to be 10 x 10 mm. Gently scribe a line down the middle or use a Sharpie pen
      • Use a clip or a screw to trap the sample onto the sample mount, or use graphite paint to trap the sample
      • If you need true bulk information, then cleave the wafer in a glove box or cleave the wafer in air and very quickly load it into the load-lock
      • NOTE:  Do NOT use the electron flood gun on semiconductors.  BE sure the FG is turned OFF unless you truly need it to control charging.
  5. Choose Instrument Settings for Data Collection
    • X-ray Power:  Maximum power
    • X-ray Beam Size:  Maximum beam size
    • Flood Gun Setting:  ~4 eV with 10 mA current, or 0.1 eV for dual beam source (Ar+/e-) for truly insulating samples (NOT semiconductors)
    • Usual electron take-off-angle
  6. Choose Data Collection Variables and Collection Settings for Each Position (Sample)
    • Always analyze as received first – before any ion etching
    • Survey Spectrum #1:  -10 eV to 1,100 eV, 1 eV/step (1 eV/channel), 50 msec/step, 3-5 scans
    • C (1s) spectrum:  275 – 305 eV, PE =50 eV, 0.1 eV/step, 50 msec/step, 5-10 scans
    • O (1s) spectrum:  515 – 575 eV, PE =50 eV, 0.1 eV/step, 50 msec/step, 5-10 scans
    • Element signal #1 spectrum:  xxx-xxx eV (60 eV window), PE =50 eV, 0.1 eV/step, 50 msec/step, 5-10 scans
    • Element signal #2 spectrum:  xxx-xxx eV (60 eV window), PE =50 eV, 0.1 eV/step, 50 msec/step, 5-10 scans
    • Valence Band spectrum:  -10 – 40 eV, PE =100 eV, 0.2 eV/step, 50 msec/step, 10-20 scans
    • Auger Signal Spectrum: xxx-xxx eV (100 eV window), PE =100 eV, 0.2 eV/step, 50 msec/step, 5-10 scans
    • Survey Spectrum #2:  -10 eV to 1,100 eV, 1 eV/step (1 eV/channel), 50 msec/step, 3-5 scans
      • NOTE:  The repeat 2nd survey spectrum checks for sample degradation due to analysis
    • Collect the second survey spectrum after very soft ion etching that removes only 1-2 nm of adventitious carbon
  7. Define and Record each position to be analyzed.  Take photo of sample inside instrument if possible.
    • Move stage to locate center of each sample position to be analyzed
    • Select O (1s) signal at 530 eV (NOTE:  Oxygen and carbon exist on all as-received samples)
    • Select “snapshot” or “fast scan conditions” to measure the O (1s) signal intensity
    • Adjust Z-Height to get the strongest intensity for the O (1s) signal
    • Define/Record each sample position to be analyzed
    • NOTE:  Optical focus is often wrong by 100-200 microns.  Better to use electronic focus
  8. Collect Data
    • Define sample analysis position #1 using Snapshot mode or fast scan mode to find maximum (best) count rate from O (1s) or C (1s) signals
    • Continue collecting data from each sample or sample position
    • If degradation is suspected, then move to fresh position ~2 mm away, to define a new fresh position to collect the next spectrum
    • Do not use slits or apertures
    • Do not tilt sample
  9. Process Data – Peak-fitting
  10. Process Data – Atom% Quantification
  11. Interpret Data – Peak-fits
  12. Interpret Data – Atom% Values
  13. Publish XPS results
  14. Publish Instrument Description
  15. Publish Data Collection Settings
  16. Publish Calibration Values